APPARATUS AND METHOD FOR TREATING SUBSTRATE

Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.