POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

A polishing liquid containing: abrasive grains; at least one hydroxy acid component selected from the group consisting of a hydroxy acid and a salt thereof; and a compound Z, in which the compound Z has a hydrocarbon group which may be substituted and a polyoxyalkylene group, and a Z value represent...

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Bibliographische Detailangaben
Hauptverfasser:	KUKITA, Tomomi, HASEGAWA, Tomoyasu, IWANO, Tomohiro
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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Beschreibung
Zusammenfassung:	A polishing liquid containing: abrasive grains; at least one hydroxy acid component selected from the group consisting of a hydroxy acid and a salt thereof; and a compound Z, in which the compound Z has a hydrocarbon group which may be substituted and a polyoxyalkylene group, and a Z value represented by General Formula (1) below is 20 or more:Z = 0.1×a2×b/c...[in Formula (1), ″a″ represents the number of carbon atoms of the hydrocarbon group, ″b″ represents the total number of oxyalkylene groups in the compound Z, and ″c″ represents an HLB value of the compound Z.]