SUBSTRATE SUPPORT PLATE FOR DEPOSITING MATERIAL ON EDGES OF A SUBSTRATE FACE

A plate configured to support at least one substrate during a deposition of material on the substrate, including at least:a solid holding surface on which a main face of the substrate is intended to be placed during the deposition, the dimensions of which are smaller than those of the main face of t...

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Bibliographische Detailangaben
Hauptverfasser:	JAY, Frédéric, THIRIOT, Benjamin, FAVRE, Wilfried
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plate configured to support at least one substrate during a deposition of material on the substrate, including at least:a solid holding surface on which a main face of the substrate is intended to be placed during the deposition, the dimensions of which are smaller than those of the main face of the substrate so that edges of the main face of the substrate are not in contact with the solid holding surface;connecting elements forming arms mechanically connecting the solid holding surface to a frame of the plate.