SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE

SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE

A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Zhang, Rui, Ayalasomayajula, Mukund, Lu, Xiao, Stover, Patrick Neel, Padmanabhan Ramalekshmi Thanu, Dinesh, Nickerson, Robert
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.