HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES

HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES

Embodiments described herein may be related to apparatuses, processes, and techniques for a barrier that surrounds one or more dies which are electrically coupled with one or more electrical connections on a wafer. The barrier may be a hermetic barrier that is formed on a wafer prior to singulation...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PELTO, Christopher M, TAYLOR, John Kevin, TANDON, Shakul, KABIR, Mohammad Enamul, ZAWADZKI, Keith, DHAYAL, Babita
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments described herein may be related to apparatuses, processes, and techniques for a barrier that surrounds one or more dies which are electrically coupled with one or more electrical connections on a wafer. The barrier may be a hermetic barrier that is formed on a wafer prior to singulation to prevent moisture intrusion from a side of the wafer that may compromise the one or more electrical connections. Other embodiments may be described and/or claimed.