STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS

STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS

A semiconductor package includes a package substrate, a semiconductor chip disposed on the package substrate, and a stiffener disposed on the package substrate. The stiffener includes an inner portion configured to surround the semiconductor chip, the inner portion defining a space on the package su...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GRAF, Richard S, NAYINI, Manish, PATEL, Janak
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes a package substrate, a semiconductor chip disposed on the package substrate, and a stiffener disposed on the package substrate. The stiffener includes an inner portion configured to surround the semiconductor chip, the inner portion defining a space on the package substrate external to the inner portion and located between the inner portion and outer edges of the package substrate, and a plurality of leg portions extending outwardly from the inner portion toward one or more of the outer edges of the package substrate and corners of the package substrate.