REPLACEMENT DEEP VIA AND BURIED OR BACKSIDE POWER RAIL WITH BACKSIDE INTERCONNECT STRUCTURE

An integrated circuit structure includes a device layer including a plurality of transistors, a first interconnect feature vertically extending through the device layer, and an interconnect structure below the device layer. The interconnect structure below the device layer includes at least a second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Majhi, Prashant, Murthy, Anand
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!