CONDUCTIVE LINE STRUCTURE HAVING CORRUGATED SURFACE

The disclosed subject matter relates generally to structures in semiconductor devices and integrated circuit (IC) chips. More particularly, the present disclosure relates to a structure for use in a conductive line. The present disclosure also relates to a method of forming the structures. The prese...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAN, JUAN BOON, ONG, RAN XING, KANG, KAI, YI, WANBING, HSIEH, CURTIS CHUN-I
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The disclosed subject matter relates generally to structures in semiconductor devices and integrated circuit (IC) chips. More particularly, the present disclosure relates to a structure for use in a conductive line. The present disclosure also relates to a method of forming the structures. The present disclosure provides a structure in a semiconductor device, the structure having a corrugated surface on at least one of its sides. The disclosed structures may have smaller or no micro-trenches and may therefore increase the breakdown voltage of the structures.