POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
The present disclosure provides a power semiconductor module in which a lead frame paddle is extended to form a source lead, a source electrode of a power semiconductor die is electrically connected to the lead frame paddle, a drain electrode is insulated from the lead frame paddle, and a part of th...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure provides a power semiconductor module in which a lead frame paddle is extended to form a source lead, a source electrode of a power semiconductor die is electrically connected to the lead frame paddle, a drain electrode is insulated from the lead frame paddle, and a part of the lead frame paddle is exposed to the outside of a mold. |
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