Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods

A semiconductor die is provided. The semiconductor die includes a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure and a trench extending from a backside of the semiconductor substrate into the semiconductor substrate. A length o...

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Bibliographische Detailangaben
Hauptverfasser: MOLZER, Wolfgang, HEROLD, Klaus, BAUMGARTNER, Peter, WAGNER, Thomas, LANGENBUCH, Michael, SINGER, Joachim, WAIDHAS, Bernd
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor die is provided. The semiconductor die includes a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure and a trench extending from a backside of the semiconductor substrate into the semiconductor substrate. A length of the trench is equal or larger than a lateral dimension of the semiconductor substrate.