SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate and that includes a first semiconductor substrate that includes through electrodes, and a second semiconductor chip disposed on the first semiconductor chip and that includes a second se...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MUN, KYUNGDON, KWAK, DONGHWA, ROH, INHO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate and that includes a first semiconductor substrate that includes through electrodes, and a second semiconductor chip disposed on the first semiconductor chip and that includes a second semiconductor substrate that includes an active surface and an inactive surface. The second semiconductor chip further includes a plurality of isolated heat dissipation fins that extend in a vertical direction from the inactive surface.