Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid

Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid

An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.

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Bibliographische Detailangaben
Hauptverfasser: Sikka, Kamal K, Bonam, Ravi K, Li, Shidong, Sakuma, Katsuyuki, Toy, Hilton T
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.