SEMICONDUCTOR MANUFACTURING APPARATUS

According to the present disclosure, a semiconductor manufacturing apparatus comprises a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape. The pickup stage comprises first pushing-up blocks at four corners. Each of the first pushing-up blocks compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAKI, Yasushi, UENO, Masaki, YAMASHITA, Kinya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to the present disclosure, a semiconductor manufacturing apparatus comprises a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape. The pickup stage comprises first pushing-up blocks at four corners. Each of the first pushing-up blocks comprises a first side parallel to one side of the semiconductor chip, a second side parallel to another side of the semiconductor chip, and an offset portion formed between the first side and the second side to be offset to an inward side of an intersection point of respective extension lines of the first side and the second side.