SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor device, including a substrate having a mounting area on a front surface thereof, a semiconductor chip disposed in the mounting area, and an exterior member having a bottom surface bonded to the front surface of the substrate, the exterior member continuously surrounding the mounting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KATSUKI, Takashi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device, including a substrate having a mounting area on a front surface thereof, a semiconductor chip disposed in the mounting area, and an exterior member having a bottom surface bonded to the front surface of the substrate, the exterior member continuously surrounding the mounting area in a loop shape in a plan view of the semiconductor device, to thereby enclose a housing space, the mounting area being in the housing space. The semiconductor device further includes a sealing material sealing the housing space.