HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first...
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| creator | MOON, Hongki LEE, Seungjoo JUNG, Hyeran KANG, Seunghoon PARK, Jongkil |
| description | According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing. |
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LEE, Seungjoo ; JUNG, Hyeran ; KANG, Seunghoon ; PARK, Jongkil</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023195167A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MOON, Hongki</creatorcontrib><creatorcontrib>LEE, Seungjoo</creatorcontrib><creatorcontrib>JUNG, Hyeran</creatorcontrib><creatorcontrib>KANG, Seunghoon</creatorcontrib><creatorcontrib>PARK, Jongkil</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOON, Hongki</au><au>LEE, Seungjoo</au><au>JUNG, Hyeran</au><au>KANG, Seunghoon</au><au>PARK, Jongkil</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME</title><date>2023-06-22</date><risdate>2023</risdate><abstract>According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME |
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