HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first...

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Bibliographische Detailangaben
Hauptverfasser:	MOON, Hongki, LEE, Seungjoo, JUNG, Hyeran, KANG, Seunghoon, PARK, Jongkil
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing.