PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer and including a connection pad; a second insulating layer disposed on the one surface of the first insulating layer and embedding the first circuit layer; a via pen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Kim, Tae Hun, Kim, Chang Gon, You, Ki Hwan, Yoon, Ho Kwon, Kim, Yeon Ji, Kim, Young Gon, Kang, Eun Seok, Lee, Seung Ju
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer and including a connection pad; a second insulating layer disposed on the one surface of the first insulating layer and embedding the first circuit layer; a via penetrating through the second insulating layer and connected to the first circuit layer; a metal post disposed on one surface of the second insulating layer and connected to the via; and a hole penetrating through the second insulating layer and exposing at least a portion of the connection pad of the first circuit layer. The metal post is spaced apart from the hole, and protrudes from the second insulating layer.