DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES

DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES

A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit;...

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Hauptverfasser: Parker, Rachael J, Dogiamis, Georgios, Johnston, David
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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creator Parker, Rachael J
Dogiamis, Georgios
Johnston, David
description A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit; a second plurality of IC dies in a second level, the second level not coplanar with the first level, the first level and the second level being coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects; and conductive pathways between the first plurality of IC dies and the second IC die for communication between the first PUF circuits and the second PUF circuit, the conductive pathways comprising a portion of the interconnects.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023187371A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023187371A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023187371A13</originalsourceid><addsrcrecordid>eNrjZLB18Qx2dHcPcnV3DHF1UXD1CwnyD4hUCHYNCvN0dg1WcPMPUvD1dA7yd_VxdQbK-Xk6KzgGB7v6Ovl4ugbzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyNjQwtzY3NDR0Nj4lQBAAW0Ky0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES</title><source>esp@cenet</source><creator>Parker, Rachael J ; Dogiamis, Georgios ; Johnston, David</creator><creatorcontrib>Parker, Rachael J ; Dogiamis, Georgios ; Johnston, David</creatorcontrib><description>A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit; a second plurality of IC dies in a second level, the second level not coplanar with the first level, the first level and the second level being coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects; and conductive pathways between the first plurality of IC dies and the second IC die for communication between the first PUF circuits and the second PUF circuit, the conductive pathways comprising a portion of the interconnects.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES ; TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230615&amp;DB=EPODOC&amp;CC=US&amp;NR=2023187371A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230615&amp;DB=EPODOC&amp;CC=US&amp;NR=2023187371A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Parker, Rachael J</creatorcontrib><creatorcontrib>Dogiamis, Georgios</creatorcontrib><creatorcontrib>Johnston, David</creatorcontrib><title>DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES</title><description>A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit; a second plurality of IC dies in a second level, the second level not coplanar with the first level, the first level and the second level being coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects; and conductive pathways between the first plurality of IC dies and the second IC die for communication between the first PUF circuits and the second PUF circuit, the conductive pathways comprising a portion of the interconnects.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB18Qx2dHcPcnV3DHF1UXD1CwnyD4hUCHYNCvN0dg1WcPMPUvD1dA7yd_VxdQbK-Xk6KzgGB7v6Ovl4ugbzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyNjQwtzY3NDR0Nj4lQBAAW0Ky0</recordid><startdate>20230615</startdate><enddate>20230615</enddate><creator>Parker, Rachael J</creator><creator>Dogiamis, Georgios</creator><creator>Johnston, David</creator><scope>EVB</scope></search><sort><creationdate>20230615</creationdate><title>DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES</title><author>Parker, Rachael J ; Dogiamis, Georgios ; Johnston, David</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023187371A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>Parker, Rachael J</creatorcontrib><creatorcontrib>Dogiamis, Georgios</creatorcontrib><creatorcontrib>Johnston, David</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Parker, Rachael J</au><au>Dogiamis, Georgios</au><au>Johnston, David</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES</title><date>2023-06-15</date><risdate>2023</risdate><abstract>A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit; a second plurality of IC dies in a second level, the second level not coplanar with the first level, the first level and the second level being coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects; and conductive pathways between the first plurality of IC dies and the second IC die for communication between the first PUF circuits and the second PUF circuit, the conductive pathways comprising a portion of the interconnects.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
title DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T11%3A54%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Parker,%20Rachael%20J&rft.date=2023-06-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023187371A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true