DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES

A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first level, each one of the first plurality of IC dies having respective first physical unclonable function (PUF) circuits; a second IC die having a second PUF circuit and a security circuit; a second plurality of IC dies in a second level, the second level not coplanar with the first level, the first level and the second level being coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects; and conductive pathways between the first plurality of IC dies and the second IC die for communication between the first PUF circuits and the second PUF circuit, the conductive pathways comprising a portion of the interconnects.