METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE

A method for fabricating a semiconductor device module includes: providing a substrate having one or more semiconductor dies disposed thereon; providing a housing; applying a reactive tape on partial surfaces of one or both of the substrate and the housing; mounting the housing onto the substrate; f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Herzer, Anita
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for fabricating a semiconductor device module includes: providing a substrate having one or more semiconductor dies disposed thereon; providing a housing; applying a reactive tape on partial surfaces of one or both of the substrate and the housing; mounting the housing onto the substrate; filling in a potting material into an interior of the housing; and curing the potting material and the reactive tape.