METHOD OF MONITORING AT LEAST ONE OF AN OVERLAY OR AN ALIGNMENT BETWEEN LAYERS OF A SEMICONDUCTOR SUBSTRATE, SCANNING PROBE MICROSCOPY SYSTEM AND COMPUTER PROGRAM

The present document relates to a method of monitoring an overlay or alignment between a first and second layer of a semiconductor using a scanning probe microscopy system. The method comprises scanning the substrate surface using a probe tip for obtaining a measurement of a topography of the first...

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Bibliographische Detailangaben
Hauptverfasser:	ZABBAL, Paul, CHUANG, Chung Bin, PIRAS, Daniele
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBEMICROSCOPY [SPM] BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SCANNING-PROBE TECHNIQUES OR APPARATUS SEMICONDUCTOR DEVICES TESTING
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