WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD OF INSPECTING WAFER USING THE SAME

A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incid...

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Bibliographische Detailangaben
Hauptverfasser: Yang, Yusin, Ryu, Sungyoon, Sohn, Younghoon
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.