STEP INTERCONNECT METALLIZATION TO ENABLE PANEL LEVEL PACKAGING

This disclosure relates to a new package concept that eliminates the need for epoxy or epoxy solder used in traditional clip/lead frame-based power packages. The disclosure overcomes this disadvantage in clip-based packages by depositing the interconnect structure directly to the bod pads. The forma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Flauta, Randolph Estal, Zhou, Zhou, Lam, Kan Wae, Hor, Wai Hung William
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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