SURFACE CLEANING WITH DIRECTED HIGH PRESSURE CHEMISTRY

SURFACE CLEANING WITH DIRECTED HIGH PRESSURE CHEMISTRY

Cleaning chambers may include a substrate support having a substrate seating position. The cleaning chambers may include a plurality of fluid nozzles facing the substrate support. Each fluid nozzle of the plurality of fluid nozzles may define a fluid port characterized by a leading edge and a traili...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kirkpatrick, Brian K, Brown, Brian J, Mikhaylichenko, Ekaterina A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:Cleaning chambers may include a substrate support having a substrate seating position. The cleaning chambers may include a plurality of fluid nozzles facing the substrate support. Each fluid nozzle of the plurality of fluid nozzles may define a fluid port characterized by a leading edge and a trailing edge. Each fluid nozzle of the plurality of fluid nozzles may be angled relative to the substrate seating position of the substrate support to produce an interior angle of greater than or about 90° at an intersection location across the substrate seating position for a fluid delivered from each fluid nozzle at the leading edge of the fluid port.