BINDERS AND CURABLE RESINS FOR MINERAL WOOL

Embodiments of a curable formaldehyde-free resin, and a method for the manufacture of the curable formaldehyde-free resin are provided herein. The curable formaldehyde-free resin is provided in the form of an aqueous dispersion. The curable formalde-hyde-free resin comprises component a) a reducing...

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Bibliographische Detailangaben
Hauptverfasser:	AZNAR ÉCIJA, Ana Isabel, MOLINERO ARENAS, Alejandro, CASADO DOMÍNGUEZ, Arturo Luís, ORTIZ ÁLVAREZ, Alba MarÍa
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BRAIDING CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON COTTON-WOOL FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS GENERAL PROCESSES OF COMPOUNDING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS KNITTING LACE-MAKING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL METALLURGY MINERAL OR SLAG WOOL NON-WOVEN FABRICS ORGANIC MACROMOLECULAR COMPOUNDS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP TRIMMINGS WADDING WORKING-UP
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Beschreibung
Zusammenfassung:	Embodiments of a curable formaldehyde-free resin, and a method for the manufacture of the curable formaldehyde-free resin are provided herein. The curable formaldehyde-free resin is provided in the form of an aqueous dispersion. The curable formalde-hyde-free resin comprises component a) a reducing sugar, component b) a polycarboxylic acid, component c) one or more polyols having a molecular weight of less than 1000 g/mol, and component d) epoxysilane. The total amount of component c) in the curable formaldehyde-free resin is between 0.5 and 10% wt. with respect to the sum of components a) and b). The amount of component d) is from 0.1% wt. to less than or equal to 2% wt. with respect to the sum of components a) and b). Further, a method for the manufacture of the curable formaldehyde-free resin according to one of the embodiments of the present disclosure is provided.