METHOD OF WAFER ALIGNMENT USING AT RESOLUTION METROLOGY ON PRODUCT FEATURES

METHOD OF WAFER ALIGNMENT USING AT RESOLUTION METROLOGY ON PRODUCT FEATURES

A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in betwe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WERKMAN, Roy, KOU, Weitian, DILLEN, Hermanus Adrianus, TEL, Wim Tjibbo, KEA, Marc Jurian
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.