SEMICONDUCTOR DEVICE

A semiconductor device includes: a main wiring wire electrically connected to a semiconductor element; a reinforcing wire connected to the semiconductor element, the reinforcing wire positioned on the same side as the semiconductor element or on the opposite side of the semiconductor element, with r...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KAWAHARA, Fumihito
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device includes: a main wiring wire electrically connected to a semiconductor element; a reinforcing wire connected to the semiconductor element, the reinforcing wire positioned on the same side as the semiconductor element or on the opposite side of the semiconductor element, with respect to the main wiring wire in a cross-sectional view; and a sealing resin configured to cover the semiconductor element, the main wiring wire, and the reinforcing wire. The reinforcing wire is connected to a plurality of portions of the semiconductor element, or both end portions of the reinforcing wire are positioned inside an outline of the semiconductor element in a plan view.