ULTRASOUND TRANSDUCER DEVICES AND METHODS FOR FABRICATING ULTRASOUND TRANSDUCER DEVICES
An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated cir...
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Zusammenfassung: | An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated circuit. A first cavity is formed in the third insulating layer. The second substrate is bonded to the first integrated circuit such that the first cavity is sealed. |
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