COMPONENT PLACEMENT SYSTEMS, MULTI-PIPETTE PLACEMENT HEADS, AND METHODS OF USING THE SAME

COMPONENT PLACEMENT SYSTEMS, MULTI-PIPETTE PLACEMENT HEADS, AND METHODS OF USING THE SAME

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to eac...

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Bibliographische Detailangaben
1. Verfasser: Brewel, Roy
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Beschreibung
Zusammenfassung:A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.