HEAT PUMP DEVICE AND ASSEMBLY

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIRCANSKI, Nenad, SADRI, Amir, WILSON, Brian David, TRAN, Thanh-Vi, MARLOWE, Carl
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.