ETHYLENE INTERPOLYMER PRODUCT AND FILMS THEREOF

An ethylene interpolymer product comprises from 40 to 80 weight % of a first ethylene interpolymer having a molecular weight distribution index of Formula (I), and, from 20 to 60 weight % of a second ethylene interpolymer having a molecular weight distribution index of Formula (II), wherein said eth...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Sadeghi, Soheil, Konaganti, Vinod
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An ethylene interpolymer product comprises from 40 to 80 weight % of a first ethylene interpolymer having a molecular weight distribution index of Formula (I), and, from 20 to 60 weight % of a second ethylene interpolymer having a molecular weight distribution index of Formula (II), wherein said ethylene interpolymer product is characterized by a dilution Index, Yd, greater than 0, and, a solid-to-liquid transition temperature not greater than 112° C. The ethylene interpolymer product may be further characterized as having a weighted Rheological Adhesion Parameter, Rhadh, greater than 1.5. Films made from the ethylene interpolymer product composition have a hot tack seal onset temperature less than 90° C. and a hot tack window at 2.5N measured on a 2 mil blown film no less than 30° C.