MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE

The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilaye...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WATANABE, Naoki, MIZUGUCHI, Denichirou, TOKUDA, Kaya, OKUYAMA, Tetsuo, MAEDA, Satoshi, YONEMUSHI, Harumi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.