METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVING HIGH COMPONENT DENSITY, AND DEVICE

The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.