RESIN COMPOSITION FOR MOLDING, AND MOLDED BODY

The purpose of the disclosure is to provide a resin composition for molding, said resin composition exhibiting good compatibility with polyolefins and containing an ultraviolet absorbing polymer that is able to be purified at a low cost, and said resin composition being capable of forming a molded b...

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Bibliographische Detailangaben
Hauptverfasser:	AOTANI, Tomoyuki, Murata, Chihiro, HU, Hao, Takahashi, Kohei, NISHINAKA, Takeshi
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The purpose of the disclosure is to provide a resin composition for molding, said resin composition exhibiting good compatibility with polyolefins and containing an ultraviolet absorbing polymer that is able to be purified at a low cost, and said resin composition being capable of forming a molded body that exhibits good transparency. A resin composition for molding containing a thermoplastic resin and an ultraviolet absorbing polymer, wherein: the ultraviolet absorbing polymer has a monomer unit represented by general formula (1), a monomer unit represented by general formula (2) and a thiol-based chain transfer agent residue; and the thiol-based chain transfer agent that forms the thiol-based chain transfer agent residue has a thiol group and one or more moieties that are selected from the group consisting of a carboxyl group, a hydroxyl group and an ester bond.