SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING SYSTEM INCLUDING THE SAME, AND SUBSTRATE POLISHING METHOD USING THE SAME

SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING SYSTEM INCLUDING THE SAME, AND SUBSTRATE POLISHING METHOD USING THE SAME

Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrod...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Hoyoung, LEE, Jaehyug, KIM, Chae Lyoung, LEE, Seungjun
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrode having a circular shape when viewed in plan. The platen may be on the inner electrode. A central axis of the inner electrode may be spaced apart from a central axis of the platen. The inner electrode may include a first electrode and a second electrode that may surround the first electrode and may have an annular shape.