MULTI CHIP HARDWARE SECURITY MODULE

MULTI CHIP HARDWARE SECURITY MODULE

A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Santiago-Fernandez, William, Iruvanti, Sushumna, Buchling Rego, Philipp K, Hadzic, Nihad, Wassick, Thomas Anthony, Busby, James, Ostrander, Steven Paul
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.