MATERIAL LAYER DEPOSITION METHODS, SEMICONDUCTOR PROCESSING SYSTEMS, AND RELATED COMPUTER PROGRAM PRODUCTS

MATERIAL LAYER DEPOSITION METHODS, SEMICONDUCTOR PROCESSING SYSTEMS, AND RELATED COMPUTER PROGRAM PRODUCTS

A material layer deposition method includes supporting a substrate in a preclean module and exposing the substrate to a preclean etchant while supported within the preclean module. The substrate is transferred to a deposition module and exposed to an adsorbate while supported within the deposition m...

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Bibliographische Detailangaben
Hauptverfasser: Demos, Alexandros, Deye, Gregory, Murali, Arun, Aryeetey, Frederick, Miskin, Caleb
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A material layer deposition method includes supporting a substrate in a preclean module and exposing the substrate to a preclean etchant while supported within the preclean module. The substrate is transferred to a deposition module and exposed to an adsorbate while supported within the deposition module. A material layer is the deposited onto the substrate while supported within the deposition module subsequent to exposing the substrate to the adsorbate. Semiconductor processing systems and computer program products are also described.