CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO REDUCE MECHANICAL STRESS ON A PORTION OF A DIE IN THE PACKAGE, AND METHODS OF FORMATION

CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO REDUCE MECHANICAL STRESS ON A PORTION OF A DIE IN THE PACKAGE, AND METHODS OF FORMATION

A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ge, You, Wang, Zhijie, Lee, Yit Meng, Ching, JR., Mariano Layson
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC over a first portion of the die is less than a second thickness over a second portion of the die to form a cavity in the MC and the MC directly contacts the first portion and the second portion of the die.