SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a cover attached to the first major die surface, the cover includes top and bottom major cover surfaces and side cover surfaces. The cover includes an opaque region disposed at a periphery of the bottom cover surface of the cover, the opaque region is configured to prevent flaring or scattering of light. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the cover, while leaving the first major cover surface exposed.