METHOD FOR CONDITIONING A PLASMA PROCESSING CHAMBER

A method for processing one or more substrates in a plasma processing chamber is provided. A plurality of cycles is provided, wherein each cycle comprises providing a pre-coat process, processing at least one substrate within the plasma processing chamber, and cleaning the plasma processing chamber....

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Bibliographische Detailangaben
Hauptverfasser: ROSCHEWSKY, Niklas, RAMACHANDRAN, Seetharaman, WILSON, Neil Marshall
Format: Patent
Sprache:eng
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Zusammenfassung:A method for processing one or more substrates in a plasma processing chamber is provided. A plurality of cycles is provided, wherein each cycle comprises providing a pre-coat process, processing at least one substrate within the plasma processing chamber, and cleaning the plasma processing chamber. The providing the pre-coat process comprises one or more cycles of depositing a silicon containing pre-coat layer and depositing a carbon containing pre-coat layer.