ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

An electronic component of the present disclosure includes: an electronic component body; an electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a portion of a perimeter of the electrode and extending across a boundary between the perim...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YASO, Toru, OIE, Hirofumi, KASHIUCHI, Kiyohiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electronic component of the present disclosure includes: an electronic component body; an electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a portion of a perimeter of the electrode and extending across a boundary between the perimeter of the electrode and the surface of the electronic component body, wherein in a plan view of the electronic component body seen from a side where the electrode is disposed, the electrode includes corners each provided by two segments defining a portion of the perimeter of the electrode, and a thickness of at least a portion of the cover layer on at least one of the corners is greater than a thickness of the other portions of the cover layer on portions other than the corners.