SUBSTRATE TREATING APPARATUS, AND METHOD OF CONTROLLING THE SUBSTRATE TREATING APPARATUS

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting un...

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Bibliographische Detailangaben
1. Verfasser:	CHO, Cheon Su
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.