BONDED SUBSTRATE AND ITS MANUFACTURING METHOD

In a bonded substrate according to an embodiment, Euler angles (φ1, θ1, ψ1) of a first quartz-crystal substrate satisfy 0°≤φ1≤2°, 123°≤θ1≤128°, and 31°≤ψ1≤44°, Euler angles (φ2, θ2, ψ2) of a second quartz-crystal substrate bonded over the first quartz-crystal substrate satisfy 83°≤φ2≤95°, 82°≤θ2≤95°...

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Hauptverfasser: KISHIDA, Kazuhito, OGAWA, Kengo, YOKOTA, Hiroaki, MARUKO, Takuya, KAKIO, Shoji
Format: Patent
Sprache:eng
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Zusammenfassung:In a bonded substrate according to an embodiment, Euler angles (φ1, θ1, ψ1) of a first quartz-crystal substrate satisfy 0°≤φ1≤2°, 123°≤θ1≤128°, and 31°≤ψ1≤44°, Euler angles (φ2, θ2, ψ2) of a second quartz-crystal substrate bonded over the first quartz-crystal substrate satisfy 83°≤φ2≤95°, 82°≤θ2≤95°, and 159°≤ψ2≤161°, and a thickness of the second quartz-crystal substrate is 0.17 to 0.19 times a wavelength of a surface acoustic wave.