INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP

A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchann...

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Hauptverfasser:	CHANG, Je-Young, RAHMAN, Mohammad Mamunur, ECTON, Jeremy D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	CHANG, Je-Young RAHMAN, Mohammad Mamunur ECTON, Jeremy D
description	A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchannel has a triangular cross-section or a trapezoidal cross-section. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.
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title	INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP
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