INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP

A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchann...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG, Je-Young, RAHMAN, Mohammad Mamunur, ECTON, Jeremy D
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchannel has a triangular cross-section or a trapezoidal cross-section. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.