SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP

SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP

Provided are a system on chip (SoC) having a three-dimensional (3D) chiplet structure, and an electronic device including the SoC. The electronic device includes a printed circuit board, the SoC on the printed circuit board, and a memory device on the SoC, wherein the SoC includes an SoC package sub...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, Kyoungmin, LEE, Heeseok, YOUN, Daehan, HUH, Junho
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:Provided are a system on chip (SoC) having a three-dimensional (3D) chiplet structure, and an electronic device including the SoC. The electronic device includes a printed circuit board, the SoC on the printed circuit board, and a memory device on the SoC, wherein the SoC includes an SoC package substrate, a first die arranged on the SoC package substrate, and having a logic circuit thereon, and a second die arranged on the first die, and having a logic circuit thereon.