Circuit Systems And Methods Using Spacer Dies

Circuit Systems And Methods Using Spacer Dies

An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.

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Bibliographische Detailangaben
Hauptverfasser: Srinivasan, Archanna, Teh, Pheak Ti, Baker, Graham, Yong, Sheue Fen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.