WAFER, ELECTRONIC COMPONENT AND METHOD USING LINED AND CLOSED SEPARATION TRENCH

WAFER, ELECTRONIC COMPONENT AND METHOD USING LINED AND CLOSED SEPARATION TRENCH

A method of processing a wafer is disclosed. In one example, the method comprises providing the wafer with a separation frame separating neighboured electronic components, forming separation trenches in the separation frame and at least partially lining sidewalls of the separation trenches with a si...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEOMANT, Sylvain, BLANK, Oliver, POLSTER, Tobias
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of processing a wafer is disclosed. In one example, the method comprises providing the wafer with a separation frame separating neighboured electronic components, forming separation trenches in the separation frame and at least partially lining sidewalls of the separation trenches with a sidewall lining for partially filling the separation trenches while maintaining a void volume therein. An exterior opening of the separation trenches is closed by a closing structure.