APPARATUS AND PROCESS WITH A DC-PULSED CATHODE ARRAY

An apparatus for sputter deposition of material on a substrate. The apparatus includes a deposition chamber and a cathode array mounted in the deposition chamber. The array has three or more rotating cathodes. Each cathode has a cylindric target of equal target length LT and a magnetic system. The c...

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Bibliographische Detailangaben
Hauptverfasser:	ELGHAZZALI, Mohamed, RATTUNDE, Oliver, EGLI, Christian
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An apparatus for sputter deposition of material on a substrate. The apparatus includes a deposition chamber and a cathode array mounted in the deposition chamber. The array has three or more rotating cathodes. Each cathode has a cylindric target of equal target length LT and a magnetic system. The cathodes are spaced from one another such that their longitudinal axes YCj are arranged parallel to each other, in a distance TSD from a substrate plane S, and spaced apart along a projection of a substrate axis X in a distance TTT, whereat each cathode of the cathode array includes a magnetic system. The magnetic system of at least one cathode is swivel mounted round respective cathode axis YCj to swivel the magnetic system into and out of a swivel plane PTS. A pedestal is designed to support at least one substrate of maximal dimensions x*y to be coated in a static way. The pedestal is positioned in the deposition chamber in front of and centered with reference to the cathode array. At least one pulsed power supply is configured for supplying and controlling a power to at least one of the cathodes.