METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION

The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining...

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Bibliographische Detailangaben
Hauptverfasser:	KITAHATA, Taro, HIROSAWA, Ryuji, SUZUKI, Sakiko, HORII, Makoto
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.